| Title | Process Type | Typical Seal Temperature | Typical Process Environment | Suggested Products* | Comments | Typical Applications |
|---|---|---|---|---|---|---|
| Plasma | PECVD ALD | 25 - 200°C | TMS, DEMS, TEOS, SiH4 , C3 H6 , NH3 , SiF4 , O2 , N2 O, NF3 | K9100 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
| Plasma | HDPCVD | 25 - 200°C | TEOS, SiH4 , NH3 , SiF 4 , O2 , C2 F6 , N2 O, NF3 , CF4 | K9100 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
| Plasma | SACVD | 25 - 200°C | TEP, TEBO, TEOS, O3 , NF3 | K9500 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
| Plasma | Ash/Strip | 25 - 200°C | O2 , CF4 , CHF3 , NH3 , H2O Vapor Forming Gas | K9500 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
| Plasma | Dielectric (Oxide) Etch | 25 - 200°C | CF4 , C3 F8 , CHF3 , SF6 , O2 , H2 | K9300 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
| Plasma | Conductor (Poly/Metal) Etch | 25 - 200°C | CF4 , CHF3 , HBr, BCl3 , CCl4 , Cl2 | K9500 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
| Thermal Processes | Metal CVD ALD LPCVD | 25 - 300°C | Organic precursors, WF6 , TiCl4 , SiH4 , HF, F2 , Cl2 , ClF3 , NF3 , H2O Vapor, O2 , O3 | K8900 K9100 | K8900 - Suggested product for metal CVD, ALD, LPCVD, oxidation and diffusion processes. |
|
| Thermal Processes | Oxidation Diffusion | 25 - 300°C | N2 , O2 , H2O, HCl, Cl2 | K8900 | K8900 - Suggested product for metal CVD, ALD, LPCVD, oxidation and diffusion processes. |
|
| Thermal Processes | Lamp Anneal RTP | 150 - 300°C | Resistance to IR absorption | K8900 | K8900 - Suggested product for metal CVD, ALD, LPCVD, oxidation and diffusion processes. |
|
| Wet Processes | Water Prep | 25 - 125°C | UPDI, Piranha SC-1, SC-2, O3 HF (49%) | K6375UP | K6375UP - General purpose product for all wet process applications. |
|
| Wet Processes | Etching | 25 - 180°C | HNO3 , HF, H2O, H3 PO4 , HNO3 Acetic/H2O | K6375UP | K6375UP - General purpose product for all wet process applications. |
|
| Wet Processes | Photolithography | 25 - 125°C | H2SO4 + Oxidant Organic Acids, nMP | K6375UP | K6375UP - General purpose product for all wet process applications. |
|
| Wet Processes | Stripping | 25 - 125°C | nMP/Alkanolamine Hydroxlamine | K6375UP | K6375UP - General purpose product for all wet process applications. |
|
| Wet Processes | Copper Plating | 25 - 100°C | CuSO4 Solution H2SO4 , H2O2 | K6375UP | K6375UP - General purpose product for all wet process applications. |
|
Suggested Kalrez® Materials for Semiconductor Applications
DuPont™ Kalrez® 6375UP is a general purpose black product for all wet process applications. This product exhibits excellent chemical resistance to all different types of wet process chemicals including acids, bases and amine-base strippers. It features low elemental extractables with good mechanical and compression set properties and is well-suited for both static and dynamic wet process seal applications (e.g., filter seals, drain seals and flow meters). A maximum application temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for Kalrez® 6375UP parts.
DuPont™ Kalrez® 8475 is a white product which reduces IR absorption and reduces seal temperature, and is well suited for RTA and RTP applications. Ultrapure post-cleaning and packaging is standard.
DuPont™ Kalrez® 8900 is a black product for all thermal processes, e.g., oxidation, diffusion furnace, metal CVD, ALD and LPCVD. It offers outstanding thermal stability, very low outgassing and excellent (low) compression set properties. Kalrez® 8900 exhibits excellent retention of physical properties at elevated temperatures, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications. A maximum application temperature of 325°C is suggested. Short excursions to higher temperatures may also be possible. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8900 parts.
DuPont™ Kalrez® 9100 is an amber translucent product targeted specifically for HDPCVD and PECVD processes. It has also exhibited excellent performance in “select” etch process applications. Kalrez® 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications. A maximum application temperature of 300°C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9100 parts.
DuPont™ Kalrez® 9300 is a brown product for Dielectric (Oxide) Etch processes. It has been specifically designed for use in applications where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”), i.e., where a balance of “physical” and “chemical” plasma erosion resistance is typically required. Kalrez® 9300 exhibits excellent resistance to oxygen and fluorine-based plasma and etch process chemistry. It also offers very low metals content, excellent thermal stability and mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 300°C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9300 parts.
DuPont™ Kalrez® 9500 is a tan product for Deposition, Ash/Strip and Conductor (Poly/Metal) Etch processes. It has been specifically designed for use in applications where ozone is used for processing, e.g. SACVD, PECVD ultra-low K (BLOK™) and where the plasma environment is more “chemical,” i.e., where oxygen and fluorine radicals are more dominant. Kalrez® 9500 exhibits excellent resistance to CVD and ash/strip process chemistry, i.e., ozone, ammonia and water vapor. It also offers outstanding thermal stability, very low outgassing and excellent mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 310°C is suggested. Kalrez® 9500 can also withstand short term excursions up to 325°C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9500 parts.
DuPont™ Kalrez® 9600 perfluoroelastomer parts are designed for high purity, high temperature vacuum applications where seals are exposed to damaging Fluorine and Oxygen plasma radicals. A maximum application temperature of 315°C is suggested. Kalrez® 9600 can also withstand short term excursions up to 325°C.Ultrapure post-cleaning and packaging is standard for all Kalrez® 9600 parts.
Additional Kalrez® Materials Available
DuPont™ Kalrez® 4079 is a black product with very wide acceptance in gas plasma applications since the 1970s. A maximum application temperature of 316°C is suggested. Ultrapure post-cleaning and packaging is available. Recommended for copy-exact situations only; contact us for recommended alternatives for new applications.
DuPont™ Kalrez® 8002 is a clear product for ash/strip and select etch and deposition processes. This unfilled product offers excellent plasma cracking resistance and ultra-low particle generation in oxygen and fluorine-based plasmas versus mineral-filled products. Kalrez® 8002 exhibits excellent resistance to dry process chemistry has good mechanical strength and is well suited for static, low stress/low sealing force and “select” bonded door seal applications. A maximum application temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8002 parts.
DuPont™ Kalrez® 8085 is a light beige, general purpose product for select etch, ash/strip and deposition processes, e.g., HDPCVD, PECVD and SACVD. It has been formulated for minimal particle generation in NF3 plasma. Kalrez® 8085 exhibits very low particle generation and low weight loss in oxygen and fluorine-based plasma, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications (e.g., bonded slit valve doors, bonded gate valves, bonded pendulum valves, gas orifice seals, gas feed-through seals, chamber lid seals). A maximum application temperature of 240 °C is suggested. Kalrez® 8085 can also withstand short-term excursions to 275 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8085 parts.
DuPont™ Kalrez® 8575 perfluoroelastomer parts are a white product for select etch, ash/strip and deposition process applications, and are also an excellent choice for exhaust line (sub-fab) seals.
DuPont™ Kalrez® 1050LF is a black product targeted specifically for semiconductor wet process applications where high concentrations of certain amines are present. It exhibits excellent amine resistance and has excellent thermal stability and mechanical strength properties. Kalrez® 1050LF is not recommended for use in organic or inorganic acids at elevated temperatures. A maximum application temperature of 288 °C is suggested. Ultrapure post-cleaning and packaging is available. Please order this product as 1050UP when specifying ultrapure post-cleaning and packaging. **NOTE: 1050LF is approaching end-of-life. Contact IES for recommended alternatives.
DuPont™ Kalrez® W240 perfluoroelastomer parts are the choice in PV wet and select dry processes as an upgrade from standard elastomers.
DuPont™ Kalrez® Spectrum™ 0040 perfluoroelastomer parts are specifically designed for low-temperature environments where significant chemical resistance is required (-42°C).
Other DuPont™ Product Information
DuPont™ Kalrez® Bonded Door Seals are used for gate valves and slit valve door seal applications. They provide improved sealing performance versus conventional o-rings by reducing particle generation, extending seal life and minimizing replacement time during preventive maintenance. Bonded doors are offered in most Kalrez® materials.
DuPont™ Tri-Lobe Seals DuPont has developed a seal design to improve seal life in dovetail grooves.
Semiconductor Product Information 1
| PRODUCT | COLOR | HARDNESS SHORE A (PELLET) 2 | HARDNESS SHORE M (O-RING) 4 | MAXIMUM APPLICATION TEMP 9 °C | 100% MODULUS 5 MPA | COMPRESSION SET 8 AT 70 HR, 204°C |
|---|---|---|---|---|---|---|
| 9100 | Amber translucent | 68 10 | 74 | 300 | 4.76 | 18 |
| 9300 | Brown | 74 10 | 78 | 300 | 6.66 | 20 |
| 9500 | Tan | 75 10 | 79 | 310 | 9.50 | 20 |
| 8002 | Clear | 69 3 | 76 | 275 | 2.88 8 | 15 |
| 8085 | Beige | 80 | 86 | 240 | 7.50 | 42 |
| 8900 | Black | 73 | 82 | 325 | 12.21 | 9 |
| 8475 | White | 60 | 71 | 300 | 2.20 | 23 |
| 6375UP | Black | 75 | 83 | 275 | 7.23 | 25 7 |
| 1050LF | Black | 82 | - | 288 | 12.40 | 35 7 |
- 1 Not to be used for specification purposes
- 2 ASTM D2240 (pellet test specimens unless otherwise noted)
- 3 JIS 6253 (plied slab test specimens)
- 4 ASTM D2240 and ASTM D1414 (AS568 K214 O-ring test specimens)
- 5 ASTM D412 (dumbbell test specimens unless otherwise noted)
- 6 JIS 6251 (dumbbell test specimens)
- 7 ASTM D395B (pellet test specimens)
- 8 ASTM D395B and ASTM D1414 (AS568 K214 O-ring test specimens unless otherwise noted)
- 9 DuPont proprietary test method
- 10 ASTM D2240 (plied slab test specimens)
