When using ammonia is a semiconductor thin film process, an FFKM class vacuum seal is recommended.
Semiconductor Vacuum Sealing Considerations When Using Ammonia (NH3)
Author: Mike Berry
Vacuum Technology: How to Choose the Right High Vacuum Isolation Valve, Part 3 of 3
Advantages and disadvantages of gate type vacuum isolation valves.
Thin Film Technology: a Look Back Over 40 Years
Doug Pelleymounter, a Senior Applications Engineer with Advanced Energy (“AE”) who focused mostly on high power PVD applications, has just announced his well-earned retirement after 22 years of service. This is a (mostly verbatim) re-post of Doug’s story, from which
Vacuum Technology: How to Choose the Right High Vacuum Isolation Valve, Part 2 of 3
Valve design plays a huge role in the functioning of a vacuum system, and many factors need to be considered. This 3 part blog will discuss each type so you can choose the best one for your application. Leak rate
Vacuum Technology: How to Choose the Right High Vacuum Isolation Valve, Part 1 of 3
First of three posts to explain the pros and cons of the common types of vacuum isolation valves: ball, poppet, and gate.
Vacuum Technology: Why Use a Conical v. Straight Reducer? Conductance.
This is a re-post of a “Tech Talk” Article originally posted by Garrett Hanrahan of ANCORP. What advantage does a conical reducer offer compared to a similarly flanged straight reducer? The answer is simple: Conductance! Over the same length, a
Vacuum Technology: To EP or Not to EP?
This is a Re-Post of Blog article by Garrett Hanrahan of ANCORP Before you determine whether or not to specify an EP (electropolish) finish on a custom-fabricated vacuum component or chamber, it helps to know what electropolishing can and cannot
Vacuum Technology: Extending Cryopump Life
Routine replacement of the adsorber in your closed cycle cryo compressor is critical for the health of the compressor and for extending service life.
What is TPO and Why is it Performed?
Discussion on Temperature Programmed Oxidation, how it is performed, and how to study the results using gas analysis.
What is TPR and How is it Performed?
Temperature programmed reduction (TPR) is a material characterization process commonly used in catalysis studies to examine the surface chemistry of metals and metal oxides under varying thermal conditions. TPR-enabled mass spectrometry equipment can acquire quantitative and qualitative data relating to