DuPont™ Kalrez® 6375UP
To transform raw semiconducting materials into a useful device requires hundreds of chemical processing steps. A significant number of these steps involve aggressive acids, solvents, and bases (including amines) used to clean, rinse, etch or strip unwanted materials and contaminants from the wafer surface. These chemicals can attack elastomeric seals causing them to swell and degrade or to leach undesirable metallic and ionic extractables that affect integrated circuit functionality.
The trend toward larger wafers, smaller feature size, and decreasing thickness of deposited layers has placed increased emphasis on the need to minimize or eliminate sources of process contamination. Chemical and equipment manufacturers go to great lengths to minimize the potential for contamination that could result in chip defects.
DuPont has developed a number of products that resist chemical attack and are formulated and processed to minimize the potential for undesirable contaminants. The newest addition to our product line, DuPont™ Kalrez® 6375UP, has an excellent balance of performance characteristics required for semicon wet processing environments.
Features/Benefits:
- Excellent chemical resistance to acids, bases & amine-based strippers
- Low elemental, anionic & total organic carbon (TOC) extractables
- Good mechanical strength/compression set properties
- 275°C thermal stability