Plasma Semiconductor Processing Seals

Features/Benefits

• Low erosion rate and ultra-low particle generation in oxygen and fluorine-based plasmas
• Excellent resistance to dry process chemistry
• Excellent thermal stability
• Very low outgassing properties and metals content
• Excellent elastic recovery and low compression set properties

Suggested Applications

• Gas inlet/orifice seals
• Chamber lid seals
• Isolation valve seals
• “Select” bonded gate valves/slit valve door seals*

Data Sheet

Features/Benefits

• Low erosion rate and ultra-low particle generation in ion/radical dominant oxygen and fluorine-based plasmas
• Excellent resistance to etch process chemistry
• Very low metals content
• Excellent thermal stability
• Excellent mechanical strength

Suggested Applications

• Gas inlet/orifice seals
• Chamber lid seals
• Isolation valve seals
• Bonded gate valves/slit valve door seals

Data Sheet

Features/Benefits

• Excellent resistance to CVD and ash/strip process chemistry (ozone, ammonia, water vapor, etc.)
• Low erosion rate and ultra-low particle generation in radical dominant oxygen and fluorine-based plasmas
• Excellent thermal stability
• Very low outgassing and metals content
• Excellent mechanical strength

Suggested Applications

• Gas inlet/orifice/mixing block seals
• Chamber lid seals
• Isolation valve seals
• Bonded gate valves/slit valve door seals

Data Sheet